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Prediction of Solder Bump Formation in Solder Jet Packaging Process

Date of Publication:2006-09-01 Hits:

Journal:IEEE Transactions on Components and Packaging Technology 29 (3): pp.486-493 SEP, 2006
ISSN No.:1521-3331
Translation or Not:no
Date of Publication:2006-09-01
Indexed by:期刊论文

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Prediction of Solder Bump Formation in Solder Jet Packaging Process