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树型微通道网络在集成微电子冷却中的应用研究.《工程热物理学报》2007年第28卷增刊2.2007
2020-06-12
毛细管电泳样品电堆积富集技术影响因素的数值研究.色谱，25(4), pp.482-485, 2007.2007
2020-06-12
毛细管电泳样品电堆积富集技术的数值研究.色谱，25(2), pp.183-188, 2007.2007
2020-06-12
Phase-change heat transfer in Microsystems.Journal of Heat Transfer 129, pp.101-108, 2007.2007
2020-06-12
The Impact of Thermal Contact Resistance on the Spreading and Solidification of a Droplet on a Su....Heat Transfer Engineering 27 (9): pp.68-80, NOV, 2006.2006
2020-06-12
Prediction of Solder Bump Formation in Solder Jet Packaging Process.IEEE Transactions on Components and Packaging Technology 29 (3): pp.486-493 SEP, 2006.2006
2020-06-12
Jason.Modeling of substrate remelting, flow, and resolidification in microcasting.Numerical Heat Transfer, Part A - Applications 48 (10): pp. 987-1008, DEC 15, 2005.2005
2020-06-12
Jason.Experimental study on rapid solidification process using a novel ultrasound technique.Experimental Thermal and Fluid Science, Vol.30, October, 2005.2005
2020-06-12

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