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Fault detection and redundancy design for TSVs in 3D ICs

Date of Publication:2016-07-01 Hits:

Journal:Proceedings - 2015 IEEE 11th International Conference on ASIC, ASICON 2015
Translation or Not:no
Date of Publication:2016-07-01
Indexed by:会议论文

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Fault detection and redundancy design for TSVs in 3D ICs