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Fast Electromagnetic Modeling of 3D Interconnects on Chip-package-board

Date of Publication:2010-07-01 Hits:

Journal:PIERS 2010 Cambridge - Progress in Electromagnetics Research Symposium, Proceedings,
ISSN No.:978-1-9341-4214-1
Translation or Not:no
Date of Publication:2010-07-01
Indexed by:会议论文

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Fast Electromagnetic Modeling of 3D Interconnects on Chip-package-board