Mechanism of forming defects in roll-to-roll hot embossing of micro-pyramid arrays: II. Numerical study
发布时间:2020-06-12
发表刊物:Journal of Micromechanics and Microengineering
ISSN号:0960-1317
是否译文:否
发表时间:2015-10-01
论文类型:期刊论文