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Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method

Date of Publication:2017-06-01 Hits:

Journal:IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN No.:2156-3950
Translation or Not:no
Date of Publication:2017-06-01
Indexed by:期刊论文

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Transient Thermal Analysis of 3-D Integrated Circuits Packages by the DGTD Method