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Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method

Date of Publication:2020-02-01 Hits:

Journal:IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN No.:2156-3950
Translation or Not:no
Date of Publication:2020-02-01
Indexed by:期刊论文

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Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method