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A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects

Date of Publication:2021-02-01 Hits:

Journal:IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
ISSN No.:0278-0070
Translation or Not:no
Date of Publication:2021-02-01
Indexed by:期刊论文

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A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects