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An Efficient ADI Method for Transient Thermal Simulation of Liquid-Cooled 3-D ICs

Date of Publication:2022-09-01 Hits:

Journal:IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN No.:2156-3950
Translation or Not:no
Date of Publication:2022-09-01
Indexed by:期刊论文

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