上海交大研究生院主页平台管理系统 Tang Min--Home--Paper Publications

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Mushroom-Type Ground Plane Structure for Wideband SSN Suppression in High-Speed Circuits.IEEE Microwave and Wireless Components Letters.2011
2020-06-12
EMI analysis of coupled interconnects on dispersive dielectrics.2011 IEEE MTT-S International Microwave Symposium.2011
2020-06-12
Performance enhancement research for printed circuit board manufacture in China.2011 IEEE MTT-S International Microwave Symposium.2011
2020-06-12
Study on multi-walled carbon nanotube resonator.12th International Conference on Electromagnetics in Advanced Applications.2010
2020-06-12
FdSPICE: A parallel simulation technique for lossy and dispersive interconnect networks.2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium.2010
2020-06-12
Transient analysis of dispersive transmission lines with incident electromagnetic fields.2010 Asia-Pacific Symposium on Electromagnetic Compatibility.2010
2020-06-12
A New Power-Ground Plane Modeling Method With Rectangle and Triangle Segmentation.IEEE Trans. Advanced Packaging.2010
2020-06-12
A compact passive model of transmission lines with frequency-dependent parameters.2010 International Conference on Microwave and Millimeter Wave Technology.2010
2020-06-12
Modeling of power-plane segmentation with cavity and planar-lumped models.2010 International Conference on Microwave and Millimeter Wave Technology.2010
2020-06-12
Finite-difference analysis of interconnects with frequency-dependent parameters based on equivale....IEEE Transactions on Advanced Packaging.2010
2020-06-12

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