上海交大研究生院主页平台管理系统 XU JIJIN--Home-- Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

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Journal:JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

ISSN No.:0957-4522

Translation or Not:no

Date of Publication:2012-01-01

Indexed by:期刊论文

Date of Publication:2012-01-01

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