上海交大研究生院主页平台管理系统 XU JIJIN--Home-- Fine grained Cu film promoting Kirkendall voiding at Cu3Sn/Cu interface

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Journal:Journal of Alloys and Compounds

ISSN No.:0925-8388

Translation or Not:no

Date of Publication:2016-03-01

Indexed by:期刊论文

Date of Publication:2016-03-01

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