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Investigating a Thermal Breakdown Model and Experiments on a Silicon-Based Low-Noise Amplifier under High-Power Microwave Pulses

Date of Publication:2016-02-01 Hits:

Journal:IEEE Transactions on Electromagnetic Compatibility
ISSN No.:0018-9375
Translation or Not:no
Date of Publication:2016-02-01
Indexed by:期刊论文

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