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Thermal-Mechanical Analysis of Packaged Power Amplifiers based on Heterogeneous Integrations using photosensitive BCB

Date of Publication:2016-09-01 Hits:

Journal:IEEE 2016 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS)
ISSN No.:0
Translation or Not:no
Date of Publication:2016-09-01
Indexed by:会议论文

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Thermal-Mechanical Analysis of Packaged Power Amplifiers based on Heterogeneous Integrations using photosensitive BCB