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Analysis of Electro-thermal-stress of the LDMOS FET Under HPM Pulses

Date of Publication:2013-12-01 Hits:

Journal:2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
ISSN No.:9781479923113
Translation or Not:no
Date of Publication:2013-12-01
Indexed by:会议论文

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Analysis of Electro-thermal-stress of the LDMOS FET Under HPM Pulses