上海交大研究生院主页平台管理系统 zhouliang--Home-- Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterogeneous Integrations

Home > Scientific Research > Paper Publications

Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterogeneous Integrations

Date of Publication:2017-12-01 Hits:

Journal:IEEE 2017 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS)
Translation or Not:no
Date of Publication:2017-12-01
Indexed by:会议论文

Pre One:Comparisons of power to failure for low-noise amplifiers under high-power microwave pulses

Next One:Wafer Level Heterogeneous Integration of a Transceiver module in Millimeter wave using photosensitive BCB

Recommend this article

Home

Scientific Research

Teaching Research

Awards and Honours

Admission Information

Student Information

My Album

Blog

Personal Information

Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterogeneous Integrations