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Calculations of Temperature Distributions for Power MMICs in 3-D Packages

Date of Publication:2018-12-01 Hits:

Journal:IEEE 2018 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS)
Translation or Not:no
Date of Publication:2018-12-01
Indexed by:会议论文

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Calculations of Temperature Distributions for Power MMICs in 3-D Packages