上海交大研究生院主页平台管理系统 Jason--Home-- The Impact of Thermal Contact Resistance on the Spreading and Solidification of a Droplet on a Substrate

Personal Information

VIEW MORE

Home > Scientific Research > Paper Publications

The Impact of Thermal Contact Resistance on the Spreading and Solidification of a Droplet on a Substrate

Date of Publication:2006-11-01 Hits:

Journal:Heat Transfer Engineering 27 (9): pp.68-80, NOV, 2006
ISSN No.:0145-7632
Translation or Not:no
Date of Publication:2006-11-01
Indexed by:期刊论文

Pre One:Phase-change heat transfer in Microsystems

Next One:Prediction of Solder Bump Formation in Solder Jet Packaging Process

Recommend this article