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毫米波芯片封装及与天线的系统集成-2023/12/01
2021/07/19
高速集成电路系统级封装电磁-热-应力协同分析设计-2017/12/01
2021/07/19
热仿真软件包开发-2014/12/01
2021/07/12
高速无源设计技术项目-2015/03/01
2021/07/12
日本大川情报通信基金(Okawa)-2016/03/01
2021/07/12
碳纳米管的相关研究-2015/12/01
2021/07/12
SiP芯片热电耦合快速仿真平台技术合作项目-2020/12/01
2021/01/28
三维集成电路功耗-温度-应力协同分析EDA关键技术研究-2022/09/01
2021/01/28
智能化芯片和系统级封装的协同设计EDA平台开发-2021/09/01
2021/01/28
面向高速率移动互联的硅基毫米波反向阵芯片关键技术-2023/12/01
2021/01/28
total41 2/5
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