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三维集成电路功耗-温度-应力协同分析EDA关键技术研究-2022/09/01
2021/01/28
智能化芯片和系统级封装的协同设计EDA平台开发-2021/09/01
2021/01/28
面向高速率移动互联的硅基毫米波反向阵芯片关键技术-2023/12/01
2021/01/28
微波衍射极限逼近问题研究-2022/12/01
2021/01/28
多物理场仿真技术开发项目-2019/12/01
2020/05/07
xx天线技术研究, 自然科学-2017/12/01
2020/05/07
电磁热仿真项目-2018/04/01
2020/05/07
碳纳米异质互连结构的多物理场协同分析和可靠性研究-2020/12/01
2020/05/07
xx评估仿真平台-2017/05/01
2020/05/07
三维系统级封装（SIP）板级应用可靠性研究, 自然科学-2016/12/01
2020/05/07
total44 3/5
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