Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method
发布时间：2021-01-28
发表刊物：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN号：2156-3950
是否译文：否
发表时间：2020-02-01
论文类型：期刊论文