研究领域
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1. 系统级封装的多物理场仿真技术与EDA工具开发
2. 高性能互连与封装集成天线设计
3. 高速集成电路的信号/电源完整性分析
论文成果 MORE+
- · A Finite Volume Scheme for Thermal Simulation Using Locally Refined Semi-structured Grids.Progress in Electromagnetics Research Symposium.2022
- · Average Power Handling Capability of Corrugated Slow-Wave Transmission Lines.MICROMACHINES.2022
- · Design of Broadband Compact Grid Array Antennas Using Gradient Slow-Wave Structures.IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS.2022
- · Flash cosintering of a lanthanum strontium cobalt ferrite nanofibre/ Gd-doped ceria bilayer structure.JOURNAL OF THE EUROPEAN CERAMIC SOCIETY.2022
- · Analytical Thermal Model for AlGaN/GaN HEMTs Using Conformal Mapping Method.IEEE TRANSACTIONS ON ELECTRON DEVICES.2022
- · A Decoupling Structure for Mutual Coupling Suppression in Stacked Microstrip Patch Antenna Array.IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS.2022
- · Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY.2022
- · Miniaturization of Frequency-Reconfigurable Antenna Using Periodic Slow-Wave Structure.IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION.2022
- · Transient Thermal Simulation of 3-D ICs with Integrated Microchannel Cooling Using Laguerre Polynomials.Progress in Electromagnetics Research Symposium.2022
- · Electrothermal Design of SIW Slot Antenna Array With Fin-Shaped Heatsink Enclosed.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY.2022
专利
著作成果
- · 高速集成电路互连
科研项目 MORE+
- · 毫米波异质集成电路-2026/12/01
- · 毫米波太赫兹集成电路多物理协同设计方法与EDA关键技术-2026/12/01
- · 仿真平台应用与示范-2025/11/01
- · 基于基片集成波导的大数据传输线理论与设计-2021/12/01
- · 毫米波异质集成电路设计理论与实现方法研究-2023/12/01
- · 射频系统级封装中天线的设计和电磁兼容问题研究-2017/12/01
- · 毫米波和C 波段融合集成平台技术-2023/06/01
- · 毫米波芯片封装及与天线的系统集成-2023/12/01
- · 高速集成电路系统级封装电磁-热-应力协同分析设计-2017/12/01
- · 热仿真软件包开发-2014/12/01