A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects
发布时间：2022-05-22
发表刊物：IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
ISSN号：0278-0070
是否译文：否
发表时间：2021-02-01
论文类型：期刊论文