An Efficient ADI Method for Transient Thermal Simulation of Liquid-Cooled 3-D ICs
发布时间:2024-01-08
发表刊物:IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN号:2156-3950
是否译文:否
发表时间:2022-09-01
论文类型:期刊论文