Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity
发布时间：2024-01-08
发表刊物：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN号：2156-3950
是否译文：否
发表时间：2022-05-01
论文类型：期刊论文