上海交大研究生院主页平台管理系统 XU JIJIN--Home-- Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints

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Journal:Materials Letters

ISSN No.:0167-577X

Translation or Not:no

Date of Publication:2014-08-01

Indexed by:期刊论文

Date of Publication:2014-08-01

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