上海交大研究生院主页平台管理系统 XU JIJIN--Home-- Effects of additive elements on structural and electronic properties of Sn-based intermetallics by first principles

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Journal:Materials Research Express

ISSN No.:2053-1591

Translation or Not:no

Date of Publication:2014-04-01

Indexed by:期刊论文

Date of Publication:2014-04-01

Pre One:Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints

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