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Multiphysics characterization of polymer-filled through-silicon vias (PF-TSVs) for three-dimensional integration

Date of Publication:2018-07-01 Hits:

Journal:INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS
ISSN No.:0894-3370
Translation or Not:no
Date of Publication:2018-07-01
Indexed by:期刊论文

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