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Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers.IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY.2018
2020-06-12
High Modes Suppressions with Transmission Zeros Design for a Novel Quarter-mode SIW Filter.IEEE International Microwave Symposium.2018
2020-06-12
Carrier Dynamics of Nanopillar Textured Ultrathin Si Film/PEDOT:PSS Heterojunction Solar Cell.IEEE JOURNAL OF PHOTOVOLTAICS.2018
2020-06-12
zhouliang.Wafer Level Heterogeneous Integration of a Millimeter-wave Transceiver module and its EMC problem....2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC).2018
2020-06-12
Discontinuous Galerkin Method Using Laguerre Polynomials for Solving a Time-Domain Electric Fie....IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS.2018
2020-06-12
Design of 3-dimensional wafer level integrations of slow-wave coupled oscillators.2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, EDAPS 2017.2018
2020-06-12
Time-Domain Discontinuous Galerkin PMCHW Integral Equation Method With MOD Scheme for Simulating ....IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY.2018
2020-06-12
Comparisons of power to failure for low-noise amplifiers under high-power microwave pulses.2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, EDAPS 2017.2018
2020-06-12
zhouliang.Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterog....IEEE 2017 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS).2017
2020-06-12
Wafer Level Heterogeneous Integration of a Transceiver module in Millimeter wave using photosens....UK/Europe-China Workshop on Millimetre-Waves and Terahertz Technologies (UCMMT).2017
2020-06-12

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