上海交大研究生院主页平台管理系统周亮--中文主页-- Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterogeneous Integrations

论文成果

当前位置: 中文主页 >> 科学研究 >> 论文成果 >> Analytical Soluti...

Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterogeneous Integrations

点击次数：
发表刊物：IEEE 2017 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS)
是否译文：否
发表时间：2017-12-01
论文类型：会议论文
发表时间：2017-12-01

上一条： Comparisons of power to failure for low-noise amplifiers under high-power microwave pulses

下一条： Wafer Level Heterogeneous Integration of a Transceiver module in Millimeter wave using photosensitive BCB