论文成果： More>>

• A Scalable HPC-based Domain Decomposition Method for Multiphysics Modeling of RF Devices .IEEE Transactions on Components, Packaging and Manufacturing Technology .2021
• Efficient Analytical Model for the Transfer Impedance and Admittance of Noncoaxial/Twinax Braided-Shielded Cables .IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY .2020
• Low-Loss Heterogeneous Integrations With High Output Power Radar Applications at W-Band .IEEE JOURNAL OF SOLID-STATE CIRCUITS .2022
• Low Loss W-Band Packaged Filtering Balun Based on a Modified Quarter-Mode Folded Substrate-Integrated Waveguide Cavity .IEEE ACCESS .2022
• Long-range Vital Sign Monitoring by Using a W Band Heterogeneously Integrated FMCW Radar Sensor .IEEE MTT-S International Microwave Symposium Digest .2022
• Investigation of Protection Effects Using Transient Voltage Suppressor Diodes-Based Circuits under High Power Microwave Pulses .2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021 .2021
• Guest Editorial .IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES .2022
• BCB-Based Thin-Film Ka-Band Quarter-Mode SIW Packaged Filters With Ultrawide Stopband and Independently Controlled TZs .IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES .2022
• A W-band High Radiation Efficiency with BCB-air Cavity-backed Antenna Based on Through Silicon Ring Trench .IEEE Antennas and Wireless Propagation Letters .2022
• A Scalable HPC-based Domain Decomposition Method for Multiphysics Modeling of RF Devices .IEEE Transactions on Components, Packaging and Manufacturing Technology .2021

专利：

• 基于复合左右手折叠基片集成波导的多层双通带耦合器 ,2020/10/16
• 基片集成波导加载介质谐振器滤波器 ,2020/10/16
• 宽带高通相位调节器 ,2020/05/08

科研项目：

• 毫米波三维异质异构集成（上海市配套） -2028/12/01
• 国家重要科技计划项目上海市地方配套 -2021/12/01
• 大川基金研究助成奖 -2018/02/01