- [71]期刊论文，Mushroom-Type Ground Plane Structure for Wideband SSN Suppression in High-Speed Circuits,IEEE Microwave and Wireless Components Letters,2011/12/01
- [72]会议论文，EMI analysis of coupled interconnects on dispersive dielectrics,2011 IEEE MTT-S International Microwave Symposium,2011/06/01
- [73]会议论文，Performance enhancement research for printed circuit board manufacture in China,2011 IEEE MTT-S International Microwave Symposium,2011/06/01
- [74]会议论文，Study on multi-walled carbon nanotube resonator,12th International Conference on Electromagnetics in Advanced Applications,2010/12/01
- [75]会议论文，FdSPICE: A parallel simulation technique for lossy and dispersive interconnect networks,2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium,2010/12/01
- [76]会议论文，Transient analysis of dispersive transmission lines with incident electromagnetic fields,2010 Asia-Pacific Symposium on Electromagnetic Compatibility,2010/11/01
- [77]期刊论文，A New Power-Ground Plane Modeling Method With Rectangle and Triangle Segmentation,IEEE Trans. Advanced Packaging,2010/08/01
- [78]会议论文，A compact passive model of transmission lines with frequency-dependent parameters,2010 International Conference on Microwave and Millimeter Wave Technology,2010/06/01
- [79]会议论文，Modeling of power-plane segmentation with cavity and planar-lumped models,2010 International Conference on Microwave and Millimeter Wave Technology,2010/06/01
- [80]期刊论文，Finite-difference analysis of interconnects with frequency-dependent parameters based on equivalent ,IEEE Transactions on Advanced Packaging,2010/05/01