| Course Name: | School Year: | Semester: | Required Class Hours: | Credits: | Course Number: |
| 集成电路与微系统封装技术 | 2023-2024 | Spring Term | 32 | 2 | (2023-2024-2)-MST3308-01 |
| 集成电路与微系统封装技术 | 2022-2023 | Spring Term | 32 | 2 | (2022-2023-2)-MST3308-01 |
| 集成电路与微系统封装技术 | 2021-2022 | Spring Term | 32 | 2 | (2021-2022-2)-MR330-1 |
| 集成电路与微系统封装技术 | 2020-2021 | Spring Term | 32 | 2 | (2020-2021-2)-MR330-1 |
| 集成电路与微系统封装技术 | 2019-2020 | Spring Term | 32 | 2 | (2019-2020-2)-MR330-1 |
| 集成电路与微系统封装技术 | 2018-2019 | Spring Term | 32 | 2 | 2018-2019-2-MR330-397929 |
| Course Name: | School Year: | Semester: | Required Class Hours: | Credits: | Course Number: |
| 集成电路高等制造工艺 | 2019-2020 | Autumn Term | 48 | 3 | ES26040 |
| 集成电路高等制造工艺 | 2018-2019 | Autumn Term | 48 | 3 | ES26040 |
| 集成电路高等制造工艺 | 2017-2018 | Autumn Term | 48 | 3 | ES26040 |
| 集成电路制造技术 | 2016-2017 | Autumn Term | 54 | 3 | P210514 |
| 集成电路高等制造工艺 | 2016-2017 | Autumn Term | 48 | 3 | ES26040 |
| 集成电路制造技术 | 2015-2016 | Autumn Term | 54 | 3 | P210514 |
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