上海交大研究生院主页平台管理系统周亮--中文主页--论文成果

所在单位：电子信息与电气工程学院
职称：教授
电子邮箱：liangzhou@sjtu.edu.cn
教师拼音名称：zhouliang
学历：博士研究生毕业
性别：男
在职信息：在职
毕业院校：英国约克大学
学科：电磁场与微波技术(080904)

论文成果

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[46] 会议论文，Design of 3-dimensional wafer level integrations of slow-wave coupled oscillators,2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, EDAPS 2017,2018-01-01
[47] 期刊论文，Time-Domain Discontinuous Galerkin PMCHW Integral Equation Method With MOD Scheme for Simulating ...,IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY,2018-07-01
[48] 会议论文，Comparisons of power to failure for low-noise amplifiers under high-power microwave pulses,2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, EDAPS 2017,2018-01-01
[49] 会议论文，Analytical Solutions of Temperature Distributions Based on Fourier Series for Wafer Level Heterog...,IEEE 2017 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS),2017-12-01,周亮
[50] 会议论文，Wafer Level Heterogeneous Integration of a Transceiver module in Millimeter wave using photosens...,UK/Europe-China Workshop on Millimetre-Waves and Terahertz Technologies (UCMMT),2017-09-01
[51] 期刊论文，Tunable THz Multiband Frequency-Selective Surface Based on Hybrid Metal-Graphene Structure,IEEE TRANSACTIONS ON NANOTECHNOLOGY,2017-09-01
[52] 期刊论文，Investigation on Failure Mechanisms of GaN HEMT Caused by High-Power Microwave (HPM) Pulses,IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY,2017-06-01,周亮
[53] 会议论文，Study on electro-thermo-mechanical responses of bonding wires arrays used for the package design ...,2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),2016-12-01
[54] 期刊论文，Investigation on Failure Mechanisms of GaN HEMT Caused by High-Power Microwave (HPM) Pulses,IEEE Transactions on Electromagnetic Compatibility,2016-11-01,周亮
[55] 期刊论文，Theory of Reflective Phase-Shifting Surface for Generating Vortex Radio Waves,IEEE Transactions on Antennas and Propagation ,2016-11-01
[56] 期刊论文，Improvement in Cavity and Model Designs of LDMOS Power Amplifier for Suppressing Metallic Shieldi...,IEEE Transactions on Electromagnetic Compatibility,2016-10-01
[57] 期刊论文，A Dual-Band Microstrip Antenna Using a Circular Ring and a Concentric Disk,International Journal of RF and Microwave Computer-Aided Engineering,2016-10-01
[58] 会议论文，Thermal-Mechanical Analysis of Packaged Power Amplifiers based on Heterogeneous Integrations usin...,IEEE 2016 Electrical Design of Advanced Packaging & Systems Packaging (EDAPS),2016-09-01
[59] 会议论文，Electro-Thermal-Stress Analysis of AlGaN/GaN HEMTs Breakdown under Intentional EMI,2016 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT 2016),2016-08-01,周亮
[60] 会议论文，Reconfigurable Graphene Reflectarray with Switchable Focus,2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP),2016-07-01

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