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High-G MEMS shock threshold sensor integrated on a copper filling through-glass-via (TGV) substrate for surface mount application

Date of Publication:2015-06-01 Hits:

Journal:The 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2015)
Translation or Not:no
Date of Publication:2015-06-01
Indexed by:会议论文

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High-G MEMS shock threshold sensor integrated on a copper filling through-glass-via (TGV) substrate for surface mount application