Development of a Polyimide/SiC-Whisker/Nano-Particles composite with high thermal conductivity and low coefficient of thermal expansion as dielectric layer for interposer application
发布时间：2020-05-08
发表刊物：Proceedings - Electronic Components And Technology Conference
ISSN号：0569-5503
是否译文：否
发表时间：2018-08-01
论文类型：会议论文