上海交大研究生院主页平台管理系统 yangzhuoqing--Home-- Development of a Polyimide/SiC-Whisker/Nano-Particles composite with high thermal conductivity and low coefficient of thermal expansion as dielectric layer for interposer application

Home > Scientific Research > Paper Publications

Development of a Polyimide/SiC-Whisker/Nano-Particles composite with high thermal conductivity and low coefficient of thermal expansion as dielectric layer for interposer application

Date of Publication:2018-08-01 Hits:

Journal:Proceedings - Electronic Components And Technology Conference
ISSN No.:0569-5503
Translation or Not:no
Date of Publication:2018-08-01
Indexed by:会议论文

Pre One:A Laterally Driven MEMS Inertial Switch With Double-Layer Suspended Springs for Improving Single-Axis Sensitivity

Next One:A laterally driven MEMS inertial switch with double-layer suspended springs for improving single-axis sensitivity

Recommend this article

Home

Scientific Research

Teaching Research

Awards and Honours

Admission Information

Student Information

My Album

Blog

Personal Information

Development of a Polyimide/SiC-Whisker/Nano-Particles composite with high thermal conductivity and low coefficient of thermal expansion as dielectric layer for interposer application